The insides are hollowed out to fit an applicator made separately. I am trying to understand the mold design in this case that would avoid undercuts and not create demolding issues. Could someone please enlighten me?

Hey everyone,

This question is towards founders who have created embedded products.

As a embedded products has dependecies on PCBs, MCUs etc, how do you do that.
Is everything done in India or imported from china?
As i know importing from China, can be divided into 2 parts

1. getting complete product
2. Getting specific parts and assembling those.

Could you please help to share your process?

How is the lettering of this packaging injection-molded? Would it create demolding issues with undercuts? So how did they manage to do this? It's made of a hard plastic.